19862091
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Paper Publications
- .Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO2 Abrasives on Sapphire Wafer:Micromachines,2022
- .A novel polishing process with rigid‑flexible composite structure plate for sapphire wafer polishing:The International Journal of Advanced Manufacturing Technology,2022
- .基于HHT方法的纳米晶粒硬质合金磨削振动特性分析:工具技术,2022
- .Enhancement effect of nonferromagnetic particles on the viscosity of magnetorheological fluid under a dynamic magnetic field:Functional Materials Letters,2021
- .基于RBF神经网络预测的多种晶粒度硬质合金磨削表面粗糙度研究:稀有金属与硬质合金,2022,50(4):87-93
- .针对汽车安全玻璃热弯成形的高温摩擦试验机研制与试验:机械设计与研究,2021
- .Study on the processing characteristics of sapphire wafer polished with different properties plates:AIP Advances,2022
- .Evolution of material removal in the magnetorheological polishing of Ti6Al4V by laser power bed fusion:Mechanics Industry,2022,23(12):1-10
- .单晶蓝宝石衬底磨粒抛光技术研究现状:福建工程学院学报,2021
- .A novel polishing process with rigid‑flexible composite structure plate for sapphire wafer polishing:The International Journal of Advanced Manufacturing Technology,2022
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