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Scientific Research
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more+- [1].Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO2 Abrasives on Sapphire Wafer:Micromachines,2022
- [2].A novel polishing process with rigid‑flexible composite structure plate for sapphire wafer polishing:The International Journal of Advanced Manufacturing Technology,2022
- [3].基于HHT方法的纳米晶粒硬质合金磨削振动特性分析:工具技术,2022
- [4].Enhancement effect of nonferromagnetic particles on the viscosity of magnetorheological fluid under a dynamic magnetic field:Functional Materials Letters,2021
- [5].基于RBF神经网络预测的多种晶粒度硬质合金磨削表面粗糙度研究:稀有金属与硬质合金,2022,50(4):87-93
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