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A novel polishing process with rigid‑flexible composite structure plate for sapphire wafer polishing
Release time:2023-04-01  Hits:

Affiliation of Author(s):材料科学与工程学院
Journal:The International Journal of Advanced Manufacturing Technology
Funded by:国家自然科学基金项目
Note:2022.09.30 通过。报告编号：L-SCI00220604
Indexed by:Journal paper
Document Code:14083
ISSN No.:0268-3768
Translation or Not:no
Date of Publication:2022-09-01

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