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赵卫华

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Associate professor  
Supervisor of Master's Candidates  

Patents

一种粗粒土路基填料试样成型压实装置

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Affilication of Author(s):土木工程学院

Patent Coverage:国内

Disigner of the Invention:Lei Hujun,Chen Junhao,Zang Wanjun,Zhang Bingqiang,林华明,Wang Qiyun

Type of Patent:实用新型

State of Patent:专利授权

Application Number:201821693363.8

Authorization number:9222774

Number of Inventors:7

Service Invention or Not:no

Application Date:2018-10-18

Publication Date:2019-08-13

Authorization Date:2019-08-13

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