Affiliation of Author(s):材料科学与工程学院
Journal:电子元件与材料
Funded by:其他课题
Indexed by:Journal paper
Document Code:4755
Volume:30
Issue:235
Page Number:47-49.
ISSN No.:1001-2028
Translation or Not:no
CN No.:51-1241/TN
Date of Publication:2011-09-01