Patents

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Affilication of Author(s):材料科学与工程学院

Patent Coverage:国内

School Sign:单独

Type of Patent:Invent

State of Patent:专利授权

Application Number:202111506772.9

Authorization number:CN 114057241 B

Service Invention or Not:no

Application Date:2021-12-10

Authorization Date:2023-09-08