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一种消除板料导电加热热膨胀的装置

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  • Affilication of Author(s):材料科学与工程学院

  • Patent Coverage:国内

  • First Author:梁卫抗

  • Disigner of the Invention:Li WenFeng,Chen dingning,钟权,王乾廷

  • Type of Patent:实用新型

  • State of Patent:专利授权

  • Application Number:201820790098.9

  • Authorization number:ZL201820790098.9

  • Number of Inventors:1

  • Service Invention or Not:no

  • Application Date:2018-05-25

  • Publication Date:2018-12-07

  • Authorization Date:2018-12-07

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