Affilication of Author(s):材料科学与工程学院

Patent Coverage:国内

School Sign:单独

First Author:洪春福

Type of Patent:Invent

State of Patent:专利授权

Application Number:202210703334.X

Authorization number:CN 115029676 B

Service Invention or Not:no

Application Date:2022-06-21

Authorization Date:2023-06-27