Affiliation of Author(s):材料科学与工程学院

Journal:Journal of Electronic Materials

Funded by:省、自治区、直辖市科技项目

Note:2019.09.08 通过。报告编号：20190988 戴品强通讯作者

Indexed by:Journal paper

Document Code:10953

Volume:48

Issue:5

Page Number:2685-2690

ISSN No.:0361-5235

Translation or Not:no

Date of Publication:2019-01-08