Patents

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Affilication of Author(s):材料科学与工程学院

Patent Coverage:国内

School Sign:单独

Type of Patent:Invent

State of Patent:专利授权

Application Number:202210443069.6

Authorization number:CN 114621584 B

Service Invention or Not:no

Application Date:2022-04-25

Authorization Date:2023-12-19