Patents

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Affilication of Author(s):材料科学与工程学院

Patent Coverage:国内

First Author:方辉

Disigner of the Invention:吴方娟,吴方娟

Type of Patent:发明专利

State of Patent:专利授权

Application Number:201410056008

Authorization number:ZL201410056008

Number of Inventors:1

Service Invention or Not:yes

Application Date:2014-02-19

Publication Date:2014-05-28

Authorization Date:2015-10-28