Paper Publications
Interfacial reactions between Cu and Zn20Sn solder doped with minor RE
- Affiliation of Author(s):材料科学与工程学院
- Journal:Journal of Materials Science Materials in Electronics
- Funded by:省、自治区、直辖市科技项目
- Note:2018.09.30 学生第一作者，导师第二署名单位20% 提供EI查收报告，将收录由SCI改为EI. 2018.08.22 2019.09.08 提供SCI报告，2018年报告。
- Indexed by:Journal paper
- Document Code:9410
- ISSN No.:0957-4522
- Translation or Not:no
- Date of Publication:2017-08-31