一种高孔隙率高连通性生物支架制备方法

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Affilication of Author(s):材料科学与工程学院

Patent Coverage:国内

First Author:Zhixiang Cui

Disigner of the Invention:司军辉,曾森

Type of Patent:发明专利

State of Patent:专利授权

Application Number:201610569584.3

Authorization number:3712920

Number of Inventors:1

Service Invention or Not:no

Application Date:2016-07-19

Publication Date:2016-12-07

Authorization Date:2020-03-10