一种提高PC框架节点抗震性能的连接结构

Affilication of Author(s):土木工程学院

Patent Coverage:国内

First Author:cui shuangshuang

Disigner of the Invention:孙浩

Type of Patent:实用新型

State of Patent:专利授权

Application Number:201920846354.6

Authorization number:10278281

Number of Inventors:3

Service Invention or Not:no

Application Date:2019-06-06

Publication Date:2020-02-19

Authorization Date:2020-04-10