Patents
一种LED阵列模块的散热结构
- Affilication of Author(s):材料科学与工程学院
- Patent Coverage:国内
- First Author:Chen dingning
- Note:2018年9月30日
- Type of Patent:实用新型
- State of Patent:专利授权
- Application Number:201820109044.1
- Authorization number:7720316
- Number of Inventors:1
- Service Invention or Not:no
- Application Date:2018-01-23
- Publication Date:2018-08-17
- Authorization Date:2018-08-17
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