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A low temperature and air- sinterable copper- diamine complex- based metal organic decomposition ink for printed electronics

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发表刊物:Journal of Materials Chemistry C

论文类型:期刊论文

文献类型:J

卷号:6

期号:24

页面范围:6406-6415

是否译文:否

发表时间:2018-06-28

收录刊物:SCI

第一作者:Yue Dong,Zhijie Lin

通讯作者:Xiaodong Li

上一条: Morphology-controllable synthesis and thermal decomposition of Ag and Ni oxalate for Ag-Ni alloy electrical contact materials

下一条: Excellent anti-arc erosion performance and corresponding mechanisms of a nickel-belt-reinforced silver-based electrical contact material

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