Patents
Release time: 2024-04-03Hits:
  • Affilication of Author(s):材料科学与工程学院
  • Patent Coverage:国内
  • School Sign:第一单位
  • First Author:肖丹
  • Type of Patent:Invent
  • State of Patent:专利公开
  • Application Number:202111530225 .4
  • Service Invention or Not:no
  • Application Date:2021-12-14
  • Publication Date:2022-04-08
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19872102
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